MIL-DTL-45204 Gold Plating

Specification Overview

MIL-DTL-45204 is the U.S. military specification for electrodeposited gold coatings on metallic substrates. It provides requirements for purity, hardness, thickness, adhesion, and electrical conductivity. This finish is often used in high-reliability environments including avionics, satellites, radar systems, and precision connectors.

• Type I: 99.7% pure soft gold
• Type II: Hardened gold (e.g. cobalt or nickel alloyed)
• Type III: Custom gold alloy for specific performance
• Grade A/B/C: Based on Knoop hardness range
• Thickness Classes: From 1.27µm to 5µm depending on application

Applications & Capabilities

• Aerospace harnesses, connectors, and switch contacts
• High-frequency RF/microwave components
• Medical implants and microelectronics
• Defense radar & weapon systems circuitry

AMPC Process Benefits

• Measurable plating thickness & uniformity reports
• Full compliance with MIL-DTL-45204 & customer print requirements
• Gold plating on copper, stainless steel, Kovar, Inconel, and titanium
• Pre-treatment: Activation, strike, and diffusion barrier options