SEMI F19 Electropolished Stainless-Steel Piping

Specification Overview

SEMI F19 defines surface-finish criteria for 300-series stainless-steel tubing and fittings used in semiconductor wafer-fab process lines. The standard focuses on:

• Surface roughness ≤ 10 µin (0.25 µm) Ra after electropolish
• Chrome-rich passive layer to minimize particle generation
• Visual cleanliness and absence of acid-burn or heat tint
• Packaging in class 100 (ISO 5) cleanroom conditions

Applications & Benefits

• Ultra-high-purity (UHP) gas distribution manifolds
• CMP slurry and DI-water loop piping
• Sub-15 nm node deposition & etch tool gas lines
• Photoresist dispense and reclaim systems

Why AMPC?

• Automated cathode-anode fixturing for ID/OD uniformity
• Certified Ra measurements with profilometer reports
• DI water final rinse & nitrogen purge packaging
• Full SEMI F19 compliance certification and CoC